Aluminium Heat Sinks 82

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Part	Manufacturer	Thermal Device Type	Profile	Body Material	Device Used On	Construction	Fin Orientation	Thermal Resistance	Approvals (V)	Height	Width	Finish	Diameter	Color	Weight	Length	Power (Rated)
6022BG	Boyd	Heat Sink		Aluminium		Fin		16.7 Ω		1.25 in (31.75 mm)	0.25 in (6.35 mm)	Anodized		Black		0.875 in (22.23 mm)
PF527G	Boyd	Heat Sink		Aluminium				7.4 Ω		0.984 in (25 mm)		Anodized		Black
281-1AB	Ohmite Manufacturing	Heat Sink		Aluminium						0.374 in (9.5 mm)	0.52 in (13.2 mm)	Anodized		Black		0.752 in (19.1 mm)
320205B00000G	Boyd	Heat Sink		Aluminium		Extruded				0.25 in (6.35 mm)		Anodized	0.305 in (7.75 mm)	Black
323005B00000G	Boyd	Heat Sink		Aluminium		Extruded	Radial	56 Ω		0.25 in (6.35 mm)		Anodized		Black
574602B03300G	Boyd	Heat Sink	U	Aluminium		Slide On	Folded Back	21.6 Ω		0.69 in (17.53 mm)	0.355 in (9.02 mm)	Anodized		Black		0.86 in (21.84 mm)
V4330N	Assmann Wsw Components	Heat Sink		Aluminium			Longitudinal	12 Ω		0.472 in (12 mm)	0.787 in (20 mm)	Black Anodized		Black		1.142 in (29 mm)
FA-T220-51E	Ohmite Manufacturing	Heat Sink		Aluminium			Omnidirectional			2 in (50.8 mm)	0.984 in (25 mm)	Anodized		Black	37 g	1.638 in (41.6 mm)
527-24AB-MS4	Wakefield-vette	Heat Sink		Aluminium		Extruded				0.24 in (6.1 mm)	2.28 in (57.9 mm)	Anodized		Black		2.402 in (61 mm)
593002B03400G	Boyd	Heat Sink	U	Aluminium		Fin		13.4 Ω		1.18 in (29.97 mm)	0.5 in (12.7 mm)	Anodized		Black		0.942 in (23.93 mm)
658-35AB-T4	Wakefield-vette	Heat Sink	Pin Fin Array	Aluminium		Fin	Omnidirectional			0.35 in (8.89 mm)	1.21 in (30.73 mm)	Anodized		Black		1.21 in (30.73 mm)
625-25AB-T4E	Wakefield-vette	Heat Sink	Pin Fin Array	Aluminium		Fin	Omnidirectional			0.252 in (6.4 mm)	0.984 in (25 mm)	Anodized		Black	5.45 g	0.984 in (25 mm)
518-95AB	Ohmite Manufacturing	Heat Sink		Aluminium		Extruded				0.949 in (24.1 mm)	2.28 in (57.9 mm)	Anodized		Black		2.402 in (61 mm)
531102B00000G	Boyd	Heat Sink		Aluminium		Extruded	Radial	10.4 Ω		1.5 in (38.1 mm)	0.5 in (12.7 mm)	Anodized		Black		1.375 in (34.92 mm)
630-45AB	Wakefield-vette	Heat Sink	Pin Fin Array	Aluminium		Fin	Omnidirectional			0.449 in (11.4 mm)	1.378 in (35 mm)	Anodized		Black	6.81 g	1.378 in (35 mm)
281-2AB	Ohmite Manufacturing	Heat Sink		Aluminium						0.5 in (12.7 mm)	0.52 in (13.2 mm)	Anodized		Black		0.752 in (19.1 mm)
374724B60024G	Boyd	Heat Sink	Pin Fin Array	Aluminium		Fin	Omnidirectional			0.709 in (18 mm)	1.378 in (35 mm)	Anodized		Black		1.378 in (35 mm)
218-40CTE5	Wakefield-vette	Heat Sink	U	Aluminium		Fin	Folded Back			0.402 in (10.2 mm)	0.5 in (12.7 mm)	Anodized		Black		1.031 in (26.2 mm)
374024B00035G	Boyd	Heat Sink	Pin Fin Array	Aluminium		Adhesive	Omnidirectional			0.394 in (10 mm)	0.906 in (23 mm)	Anodized		Black		0.906 in (23 mm)
517-95AB-MS4	Wakefield-vette	Heat Sink		Aluminium		Extruded				0.949 in (24.1 mm)	2.28 in (57.9 mm)	Anodized		Black		2.402 in (61 mm)
528-45AB	Ohmite Manufacturing	Heat Sink		Aluminium		Extruded				0.449 in (11.4 mm)	2.28 in (57.9 mm)	Anodized		Black		2.402 in (61 mm)
574902B03300G	Boyd	Heat Sink		Aluminium		Slide On	Folded Back	16 Ω		1.375 in (34.93 mm)	0.355 in (9.02 mm)	Anodized		Black		0.86 in (21.84 mm)
SW50-4G	Boyd	Heat Sink		Aluminium		Extruded	Radial			1.969 in (50 mm)	0.492 in (12.5 mm)	Anodized		Black		1.358 in (34.5 mm)
242-125ABE-22	Wakefield-vette	Heat Sink		Aluminium		Fin	Staggered			1.283 in (32.6 mm)	0.252 in (6.4 mm)	Anodized		Black		0.874 in (22.2 mm)
302NN	Wakefield-vette	Heat Sink		Aluminium		Extruded				1.5 in (38.1 mm)	2 in (50.8 mm)	Anodized		Black	60.33 g	2 in (50.8 mm)
527-45AB	Ohmite Manufacturing	Heat Sink		Aluminium		Extruded				0.449 in (11.4 mm)	2.28 in (57.9 mm)	Anodized		Black		2.402 in (61 mm)
574602B03300	Boyd	Heat Sink		Aluminium	Transistor		Folded Back			0.027 in (0.69 mm)	0.016 in (0.395 mm)	Black Anodized		Black		0.034 in (0.86 mm)
578622B03200G	Boyd	Heat Sink	U	Aluminium	Transistor	Fin	Transverse	13.2 Ω		1 in (25.4 mm)	0.5 in (12.7 mm)	Anodized		Black		1.48 in (37.59 mm)
680-125220	Wakefield-vette	Heat Sink		Aluminium			Omnidirectional			1.252 in (31.8 mm)	1.811 in (46 mm)	Anodized		Black	49.9 g	1.811 in (46 mm)
PF433G	Boyd	Heat Sink	Clip	Aluminium	Transistor		Transverse			0.768 in (19.5 mm)	0.512 in (13 mm)	Anodized		Black		0.5 in (12.7 mm)
552844B00000G	Boyd	Heat Sink		Aluminium		Fin		8.7 Ω		0.72 in (18.29 mm)	1.78 in (45.2 mm)	Anodized		Black		1.78 in (45.2 mm)
576802B03900G	Boyd	Heat Sink	U	Aluminium		Clip	Transverse	27.3 Ω		0.75 in (19.05 mm)	0.5 in (12.7 mm)	Anodized		Black		0.5 in (12.7 mm)
577002B04000G	Boyd	Heat Sink	U	Aluminium		Fin	Transverse	32 Ω		0.75 in (19.05 mm)	0.25 in (6.35 mm)	Anodized		Black		0.52 in (13.21 mm)
HTS501-P	TE Connectivity	Heat Sink	Clip	Aluminium	IC		Radial		UL	0.357 in (9.06 mm)			1.375 in (34.92 mm)				15 W

Heat Sinks

Heat sinks are passive cooling devices that are used to dissipate heat generated by electronic components such as CPUs, GPUs, and power amplifiers. They work by increasing the surface area available for heat dissipation, allowing heat to be transferred more efficiently from the component to the surrounding air.

Heat sinks come in a variety of shapes and sizes, including finned heat sinks, pin fin heat sinks, and heat pipes. They are typically made of aluminum or copper, which have high thermal conductivity and good heat dissipation properties.

Heat sinks are mounted directly onto the electronic component using thermal interface material, such as thermal paste or thermal pads. The thermal interface material fills any gaps between the heat sink and the component, ensuring efficient heat transfer.

Heat sinks offer several advantages over other types of cooling devices. They are passive, which means they do not require any additional power to operate. They are also highly reliable and have no moving parts that can wear out or break down over time.

However, heat sinks also have some limitations, such as limited cooling capacity and susceptibility to external disturbances. They also require adequate airflow to be effective, which can be a challenge in confined spaces.