2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR Power Bipolar Junction Transistors (BJT) 11

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) Maximum Drain Current (Abs) (ID) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Gate-Emitter Voltage Maximum Turn Off Time (toff) Maximum Gate-Emitter Threshold Voltage Terminal Finish Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

MG150H2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

150 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

80

SILICON

550 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG100G2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG75H2DL2

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

75 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

80

SILICON

500 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG30G2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

250 W

30 A

PLASTIC/EPOXY

SWITCHING

2 V

UNSPECIFIED

RECTANGULAR

2

2000 ns

6

FLANGE MOUNT

BIP General Purpose Power

100

150 Cel

SILICON

450 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG150G2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

150 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG75G2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

75 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

80

SILICON

450 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG50G2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

50 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG100H2DL2

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

80

SILICON

550 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

4AC13

Renesas Electronics

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

5 A

PLASTIC/EPOXY

AMPLIFIER

THROUGH-HOLE

RECTANGULAR

4

10

IN-LINE

1000

150 Cel

SILICON

50 V

SINGLE

R-PSIP-T10

Not Qualified

4AC14

Renesas Electronics

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

5 A

PLASTIC/EPOXY

AMPLIFIER

THROUGH-HOLE

RECTANGULAR

4

10

IN-LINE

1000

150 Cel

SILICON

150 V

SINGLE

R-PSIP-T10

Not Qualified

4AC12

Renesas Electronics

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

2 A

PLASTIC/EPOXY

AMPLIFIER

THROUGH-HOLE

RECTANGULAR

4

10

IN-LINE

7000

150 Cel

SILICON

27 V

SINGLE

R-PSIP-T10

Not Qualified

Power Bipolar Junction Transistors (BJT)

Power Bipolar Junction Transistors (BJT) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as power supplies, motor drives, and welding equipment.

The Power BJT is a three-layer device that consists of an emitter, base, and collector region. The emitter and collector are heavily doped, while the base region is lightly doped. The power BJT works by controlling the flow of majority charge carriers (electrons or holes) from the emitter to the collector region through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

Power BJTs are designed to handle high current and voltage levels, and have a low on-resistance and high gain. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.

Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.

Proper selection and use of Power BJTs are critical to ensure safe and reliable operation of power electronics systems. Power BJTs are often used in conjunction with other components, such as diodes and capacitors, to form complete power electronics circuits.