2.1 W Power Bipolar Junction Transistors (BJT) 14

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) Maximum Drain Current (Abs) (ID) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Gate-Emitter Voltage Maximum Turn Off Time (toff) Maximum Gate-Emitter Threshold Voltage Terminal Finish Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

ZXTP2012ZTA

Diodes Incorporated

PNP

SINGLE

YES

120 MHz

2.1 W

4.3 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

1

3

FLANGE MOUNT

Other Transistors

10

150 Cel

SILICON

60 V

Matte Tin (Sn)

SINGLE

R-PSFM-F3

1

COLLECTOR

Not Qualified

e3

30

260

ZXTN2010ZTA

Diodes Incorporated

NPN

SINGLE

YES

130 MHz

2.1 W

5 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

20

150 Cel

SILICON

60 V

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

Not Qualified

e3

30

260

ZX5T955ZTA

Diodes Incorporated

PNP

SINGLE

YES

120 MHz

2.1 W

3 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

45

150 Cel

SILICON

140 V

MATTE TIN

SINGLE

R-PSSO-F3

1

Not Qualified

e3

30

260

NSV20200DMTWTBG

Onsemi

PNP

SEPARATE, 2 ELEMENTS

YES

155 MHz

2.1 W

2 A

PLASTIC/EPOXY

SWITCHING

.39 V

NO LEAD

SQUARE

2

6

SMALL OUTLINE

2.1 W

100

150 Cel

SILICON

20 V

-55 Cel

MATTE TIN

DUAL

S-PDSO-N6

1

e3

30

260

AEC-Q101

NSS20200DMTTBG

Onsemi

PNP

SEPARATE, 2 ELEMENTS

YES

155 MHz

2.1 W

2 A

PLASTIC/EPOXY

SWITCHING

.39 V

NO LEAD

SQUARE

2

6

SMALL OUTLINE

2.1 W

100

150 Cel

SILICON

20 V

-55 Cel

MATTE TIN

DUAL

S-PDSO-N6

1

e3

30

260

PHE13003A

NXP Semiconductors

NPN

SINGLE

NO

2.1 W

1 A

PLASTIC/EPOXY

SWITCHING

THROUGH-HOLE

ROUND

1

3

CYLINDRICAL

Other Transistors

5

150 Cel

SILICON

400 V

TIN

BOTTOM

O-PBCY-T3

Not Qualified

TO-92

e3

30

260

BUJ100LR

NXP Semiconductors

NPN

SINGLE

NO

2.1 W

1 A

PLASTIC/EPOXY

SWITCHING

THROUGH-HOLE

ROUND

1

3

CYLINDRICAL

Other Transistors

5

150 Cel

SILICON

400 V

TIN

BOTTOM

O-PBCY-T3

Not Qualified

TO-92

e3

30

260

DXTN06080BFG-7

Diodes Incorporated

NPN

SINGLE

YES

130 MHz

2.1 W

1 A

PLASTIC/EPOXY

SWITCHING

.5 V

FLAT

SQUARE

1

8

SMALL OUTLINE

25

150 Cel

11 pF

SILICON

80 V

-55 Cel

MATTE TIN

DUAL

S-PDSO-F8

COLLECTOR

e3

260

ZX5T951ZTA

Diodes Incorporated

PNP

SINGLE

YES

120 MHz

2.1 W

4.3 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

10

150 Cel

SILICON

60 V

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

Not Qualified

e3

ZXTN2005ZQTA

Diodes Incorporated

NPN

SINGLE

YES

150 MHz

2.1 W

5.5 A

PLASTIC/EPOXY

SWITCHING

.2 V

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

40

150 Cel

48 pF

SILICON

25 V

-55 Cel

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

HIGH RELIABILITY

e3

260

AEC-Q101; MIL-STD-202

ZXTN2011ZTA

Diodes Incorporated

NPN

SINGLE

YES

130 MHz

2.1 W

4.5 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

Other Transistors

10

150 Cel

SILICON

100 V

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

Not Qualified

e3

260

ZXTP2014ZQTA

Diodes Incorporated

PNP

SINGLE

YES

120 MHz

2.1 W

3 A

PLASTIC/EPOXY

SWITCHING

.33 V

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

45

150 Cel

33 pF

SILICON

140 V

-55 Cel

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

e3

260

AEC-Q101; IATF 16949; MIL-STD-202

ZXTP2009ZTA

Diodes Incorporated

PNP

SINGLE

YES

152 MHz

2.1 W

5.5 A

PLASTIC/EPOXY

SWITCHING

.185 V

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

110

150 Cel

53 pF

SILICON

40 V

-55 Cel

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

Not Qualified

e3

30

260

ZXTP2008ZQTA

Diodes Incorporated

PNP

SINGLE

YES

110 MHz

2.1 W

5.5 A

PLASTIC/EPOXY

SWITCHING

.175 V

FLAT

RECTANGULAR

1

3

SMALL OUTLINE

10

150 Cel

83 pF

SILICON

30 V

-55 Cel

MATTE TIN

SINGLE

R-PSSO-F3

1

COLLECTOR

HIGH RELIABILITY

e3

30

260

AEC-Q101; MIL-STD-202

Power Bipolar Junction Transistors (BJT)

Power Bipolar Junction Transistors (BJT) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as power supplies, motor drives, and welding equipment.

The Power BJT is a three-layer device that consists of an emitter, base, and collector region. The emitter and collector are heavily doped, while the base region is lightly doped. The power BJT works by controlling the flow of majority charge carriers (electrons or holes) from the emitter to the collector region through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

Power BJTs are designed to handle high current and voltage levels, and have a low on-resistance and high gain. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.

Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.

Proper selection and use of Power BJTs are critical to ensure safe and reliable operation of power electronics systems. Power BJTs are often used in conjunction with other components, such as diodes and capacitors, to form complete power electronics circuits.