.8 A RF Power Bipolar Junction Transistors (BJT) 12

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum VCEsat Minimum Power Gain (Gp) Terminal Form Package Shape No. of Elements Highest Frequency Band No. of Terminals Package Style (Meter) Sub-Category Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

BLU99

NXP Semiconductors

NPN

SINGLE

NO

4000 MHz

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

10.5 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

12.5 W

25

200 Cel

SILICON

16 V

RADIAL

O-CRPM-F4

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

LWE2025R

NXP Semiconductors

NPN

SINGLE

YES

8 W

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

7 dB

FLAT

ROUND

1

S BAND

2

DISK BUTTON

Other Transistors

8 W

200 Cel

SILICON

16 V

RADIAL

O-CRDB-F2

EMITTER

Not Qualified

BLX97

NXP Semiconductors

NPN

SINGLE

NO

.8 A

PLASTIC/EPOXY

AMPLIFIER

5.5 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

12.5 W

200 Cel

SILICON

27 V

RADIAL

O-PRPM-F4

ISOLATED

Not Qualified

BLU99/SL

NXP Semiconductors

NPN

SINGLE

YES

4000 MHz

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

10.5 dB

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

DISK BUTTON

12.5 W

25

200 Cel

SILICON

16 V

RADIAL

O-CRDB-F4

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

BLV92

NXP Semiconductors

NPN

SINGLE

YES

4000 MHz

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

7.5 dB

FLAT

RECTANGULAR

1

ULTRA HIGH FREQUENCY BAND

6

FLANGE MOUNT

9 W

25

200 Cel

SILICON

16 V

DUAL

R-CDFM-F6

ISOLATED

Not Qualified

HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS

LTE21025R

NXP Semiconductors

NPN

SINGLE

NO

8 W

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

C BAND

2

FLANGE MOUNT

Other Transistors

8 W

15

200 Cel

SILICON

16 V

RADIAL

O-CRFM-F2

EMITTER

Not Qualified

LTE42012R

NXP Semiconductors

NPN

SINGLE

NO

8 W

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

6 dB

FLAT

ROUND

1

C BAND

2

FLANGE MOUNT

Other Transistors

8 W

15

200 Cel

SILICON

16 V

RADIAL

O-CRFM-F2

EMITTER

Not Qualified

DIFFUSED EMITTER BALLASTING RESISTORS

2SC2104

Toshiba

NPN

SINGLE

NO

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

POST/STUD MOUNT

20 pF

SILICON

17 V

RADIAL

O-CRPM-F4

Not Qualified

2SC2391

Toshiba

NPN

SINGLE

NO

.8 A

CERAMIC, METAL-SEALED COFIRED

AMPLIFIER

FLAT

ROUND

1

ULTRA HIGH FREQUENCY BAND

4

FLANGE MOUNT

20 pF

SILICON

17 V

TIN LEAD

RADIAL

O-CRFM-F4

Not Qualified

e0

2SC1955

Toshiba

NPN

SINGLE

NO

.8 A

METAL

AMPLIFIER

WIRE

ROUND

1

VERY HIGH FREQUENCY BAND

3

CYLINDRICAL

15 pF

SILICON

17 V

TIN LEAD

BOTTOM

O-MBCY-W3

EMITTER

Not Qualified

e0

2SC1765

Toshiba

NPN

SINGLE

NO

.8 A

METAL

AMPLIFIER

PIN/PEG

ROUND

1

ULTRA HIGH FREQUENCY BAND

3

FLANGE MOUNT

15 pF

SILICON

17 V

TIN LEAD

BOTTOM

O-MBFM-P3

EMITTER

Not Qualified

e0

2SC2117

Toshiba

NPN

SINGLE

NO

.8 A

METAL

AMPLIFIER

PIN/PEG

ROUND

1

VERY HIGH FREQUENCY BAND

3

FLANGE MOUNT

15 pF

SILICON

17 V

TIN LEAD

BOTTOM

O-MBFM-P3

EMITTER

Not Qualified

e0

RF Power Bipolar Junction Transistors (BJT)

RF Power Bipolar Junction Transistors (BJT) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.

RF Power BJTs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.

The RF Power BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

RF Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.

Proper selection and use of RF Power BJTs are critical to ensure optimal performance, reliability, and compatibility with other components in the circuit. RF Power BJTs are often used in conjunction with other components, such as filters and matching networks, to form complete RF power amplification circuits.