Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum VCEsat | Minimum Power Gain (Gp) | Terminal Form | Package Shape | No. of Elements | Highest Frequency Band | No. of Terminals | Package Style (Meter) | Sub-Category | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi |
NPN |
SINGLE |
YES |
2 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
R-CDFM-F2 |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||
Microsemi |
NPN |
SINGLE |
YES |
1 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
R-CDFM-F2 |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
100 MHz |
3 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
4 |
SMALL OUTLINE |
SILICON |
60 V |
TIN |
DUAL |
R-PDSO-G4 |
1 |
COLLECTOR |
e3 |
|||||||||||||||||
Microsemi |
NPN |
SINGLE |
YES |
16 A |
PLASTIC/EPOXY |
FLAT |
ROUND |
1 |
VERY HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
200 Cel |
SILICON |
35 V |
RADIAL |
O-PRFM-F4 |
Not Qualified |
HIGH RELIABILTY, WITH EMITTER BALLASTING RESISTORS |
||||||||||||||||||||
Toshiba |
NPN |
SINGLE |
YES |
250 W |
25 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
ROUND |
1 |
HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
10 |
175 Cel |
SILICON |
18 V |
RADIAL |
O-CRFM-F4 |
Not Qualified |
|||||||||||||||||
|
Microsemi |
NPN |
SINGLE |
YES |
250 W |
6.5 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
ROUND |
1 |
L BAND |
4 |
DISK BUTTON |
Other Transistors |
15 |
200 Cel |
16 pF |
SILICON |
TIN LEAD |
RADIAL |
O-CRDB-F4 |
Not Qualified |
e0 |
||||||||||||||
Microsemi |
NPN |
SINGLE |
YES |
8 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
R-CDFM-F2 |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||
|
Microsemi |
NPN |
SINGLE |
YES |
250 W |
6.5 A |
UNSPECIFIED |
AMPLIFIER |
FLAT |
ROUND |
1 |
L BAND |
4 |
DISK BUTTON |
BIP RF Small Signal |
20 |
200 Cel |
50 pF |
SILICON |
65 V |
TIN LEAD |
RADIAL |
O-XRDB-F4 |
Not Qualified |
e0 |
|||||||||||||
Microchip Technology |
NPN |
SINGLE |
YES |
2.5 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
S BAND |
2 |
FLANGE MOUNT |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
R-CDFM-F2 |
Not Qualified |
HIGH RELIABILITY |
e0 |
||||||||||||||||||
|
Microsemi |
NPN |
SINGLE |
YES |
270 W |
8 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
BIP RF Small Signal |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
R-CDFM-F2 |
BASE |
Not Qualified |
e0 |
|||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
100 MHz |
3 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
4 |
SMALL OUTLINE |
SILICON |
100 V |
TIN |
DUAL |
R-PDSO-G4 |
1 |
COLLECTOR |
e3 |
|||||||||||||||||
Microsemi |
NPN |
SINGLE |
YES |
7 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
SQUARE |
1 |
L BAND |
2 |
FLANGE MOUNT |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
S-CDFM-F2 |
BASE |
Not Qualified |
e0 |
||||||||||||||||||
Microsemi |
NPN |
SINGLE |
YES |
1025 MHz |
220 W |
5.52 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
ROUND |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
15 |
200 Cel |
SILICON |
65 V |
TIN LEAD |
DUAL |
O-PDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY, WITH EMITTER BALLASTING RESISTORS |
e0 |
||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
29 W |
2.3 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
15 |
200 Cel |
SILICON |
15 V |
DUAL |
R-PDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY |
|||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
100 MHz |
3 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
4 |
SMALL OUTLINE |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G4 |
1 |
COLLECTOR |
e3 |
|||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
2 W |
.5 A |
PLASTIC/EPOXY |
AMPLIFIER |
10 dB |
GULL WING |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
4 |
SMALL OUTLINE |
Other Transistors |
2 W |
25 |
175 Cel |
6 pF |
SILICON |
10 V |
MATTE TIN |
DUAL |
R-PDSO-G4 |
1 |
COLLECTOR |
Not Qualified |
HIGH RELIABILITY |
e3 |
260 |
|||||||
Toshiba |
NPN |
SINGLE |
YES |
100 MHz |
250 W |
25 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
13 dB |
FLAT |
ROUND |
1 |
HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
250 W |
10 |
175 Cel |
SILICON |
18 V |
RADIAL |
O-CRFM-F4 |
Not Qualified |
||||||||||||||
Microsemi |
NPN |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
200 Cel |
SILICON |
TIN LEAD |
DUAL |
R-CDFM-F2 |
Not Qualified |
e0 |
||||||||||||||||||||
Motorola |
NPN |
SINGLE |
YES |
175 W |
11 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
4.4 dB |
FLAT |
ROUND |
1 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
175 W |
20 |
150 Cel |
150 pF |
SILICON |
16 V |
UNSPECIFIED |
O-CXFM-F4 |
Not Qualified |
||||||||||||||
Toshiba |
NPN |
SINGLE |
YES |
250 W |
20 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
ROUND |
1 |
HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
10 |
175 Cel |
600 pF |
SILICON |
35 V |
RADIAL |
O-CRFM-F4 |
Not Qualified |
||||||||||||||||
Toshiba |
NPN |
SINGLE |
YES |
220 W |
20 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
6.4 dB |
FLAT |
ROUND |
1 |
VERY HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
Other Transistors |
220 W |
10 |
175 Cel |
320 pF |
SILICON |
16 V |
UNSPECIFIED |
O-CXFM-F6 |
Not Qualified |
||||||||||||||
Motorola |
NPN |
SINGLE |
YES |
175 W |
15 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
4.15 dB |
FLAT |
ROUND |
1 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
175 W |
40 |
150 Cel |
220 pF |
SILICON |
16.5 V |
UNSPECIFIED |
O-CXFM-F4 |
Not Qualified |
||||||||||||||
Toshiba |
NPN |
SINGLE |
YES |
175 W |
20 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
ROUND |
1 |
HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
10 |
175 Cel |
500 pF |
SILICON |
18 V |
RADIAL |
O-CRFM-F4 |
Not Qualified |
||||||||||||||||
Toshiba |
NPN |
SINGLE |
YES |
15 W |
1.4 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
7.7 dB |
FLAT |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
Other Transistors |
15 W |
10 |
175 Cel |
25 pF |
SILICON |
17 V |
DUAL |
R-CDFM-F4 |
Not Qualified |
||||||||||||||
Onsemi |
NPN |
COMMON EMITTER, 2 ELEMENTS |
YES |
16 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
FLAT |
RECTANGULAR |
2 |
ULTRA HIGH FREQUENCY BAND |
8 |
FLANGE MOUNT |
200 Cel |
95 pF |
SILICON |
30 V |
DUAL |
R-CDFM-F8 |
Not Qualified |
HIGH RELIABILITY |
||||||||||||||||||
Texas Instruments |
NPN |
SINGLE |
YES |
400 MHz |
18 W |
1 A |
CERAMIC, METAL-SEALED COFIRED |
FLAT |
ROUND |
1 |
4 |
DISK BUTTON |
Other Transistors |
10 |
175 Cel |
SILICON |
40 V |
RADIAL |
O-CRDB-F4 |
Not Qualified |
TO-117 |
|||||||||||||||||
Analog Devices |
NPN |
SINGLE WITH BUILT-IN DIODE |
YES |
1.2 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
8 |
SMALL OUTLINE |
150 Cel |
SILICON |
15 V |
DUAL |
R-PDSO-G8 |
Not Qualified |
||||||||||||||||||||
|
Analog Devices |
NPN |
SINGLE |
YES |
1.2 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
10 |
SMALL OUTLINE |
Other Transistors |
100 |
150 Cel |
SILICON |
15 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G10 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||
|
Analog Devices |
NPN |
SINGLE |
YES |
1.2 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
8 |
SMALL OUTLINE |
Other Transistors |
100 |
150 Cel |
SILICON |
15 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||
|
Analog Devices |
NPN |
SINGLE WITH BUILT-IN DIODE |
YES |
1.2 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
8 |
SMALL OUTLINE |
Other Transistors |
100 |
150 Cel |
SILICON |
15 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||
|
Analog Devices |
NPN |
SINGLE WITH BUILT-IN DIODE |
YES |
1.2 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
8 |
SMALL OUTLINE |
Other Transistors |
100 |
150 Cel |
SILICON |
15 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||
Onsemi |
NPN |
COMPLEX |
YES |
550 MHz |
.05 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
5 |
14 |
SMALL OUTLINE |
SILICON |
15 V |
TIN LEAD |
DUAL |
R-PDSO-G14 |
Not Qualified |
e0 |
235 |
|||||||||||||||||||
Onsemi |
NPN |
COMPLEX |
YES |
550 MHz |
.05 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
5 |
14 |
SMALL OUTLINE |
SILICON |
15 V |
TIN LEAD |
DUAL |
R-PDSO-G14 |
1 |
Not Qualified |
e0 |
235 |
||||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
575 W |
16 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
7 dB |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
10 |
250 Cel |
SILICON |
40 V |
DUAL |
R-CDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY |
||||||||||||||
|
STMicroelectronics |
NPN |
SINGLE |
YES |
175 W |
10 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
ROUND |
1 |
ULTRA HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
Other Transistors |
200 Cel |
SILICON |
16 V |
UNSPECIFIED |
O-PXFM-F6 |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
600 W |
17.8 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
FLAT |
SQUARE |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
15 |
200 Cel |
SILICON |
DUAL |
S-CDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY |
||||||||||||||||
STMicroelectronics |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
330 W |
40 A |
PLASTIC/EPOXY |
FLAT |
RECTANGULAR |
1 |
VERY HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
Other Transistors |
15 |
200 Cel |
360 pF |
SILICON |
55 V |
DUAL |
R-PDFM-F6 |
Not Qualified |
HIGH RELIABILITY |
||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
50 W |
2 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
6 dB |
FLAT |
RECTANGULAR |
1 |
S BAND |
2 |
FLANGE MOUNT |
Other Transistors |
30 |
200 Cel |
SILICON |
DUAL |
R-CDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY |
|||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
220 W |
7 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
8.4 dB |
FLAT |
RECTANGULAR |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
20 |
250 Cel |
SILICON |
DUAL |
R-CDFM-F2 |
BASE |
Not Qualified |
||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
875 W |
16 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
8.7 dB |
FLAT |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
2 |
FLANGE MOUNT |
Other Transistors |
15 |
250 Cel |
SILICON |
DUAL |
R-CDFM-F2 |
BASE |
Not Qualified |
||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
67 W |
2.67 A |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
6.7 dB |
FLAT |
SQUARE |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
15 |
200 Cel |
SILICON |
DUAL |
S-CDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY |
|||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
150 W |
9 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
Other Transistors |
150 Cel |
SILICON |
18 V |
DUAL |
R-PDFM-F6 |
Not Qualified |
HIGH RELIABILITY |
|||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
219 W |
5.5 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
ROUND |
1 |
L BAND |
4 |
DISK BUTTON |
Other Transistors |
10 |
200 Cel |
SILICON |
RADIAL |
O-PRDB-F4 |
Not Qualified |
WITH EMITTER BALLASTING RESISTORS |
|||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
87.5 W |
1.5 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
ROUND |
1 |
L BAND |
4 |
DISK BUTTON |
Other Transistors |
10 |
200 Cel |
SILICON |
RADIAL |
O-PRDB-F4 |
BASE |
Not Qualified |
WITH EMITTER BALLASTING RESISTORS |
||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
22 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
SQUARE |
1 |
L BAND |
2 |
FLANGE MOUNT |
Other Transistors |
175 Cel |
SILICON |
DUAL |
S-PDFM-F2 |
BASE |
Not Qualified |
|||||||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
100 W |
4 A |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
6.2 dB |
FLAT |
RECTANGULAR |
1 |
S BAND |
2 |
FLANGE MOUNT |
Other Transistors |
30 |
250 Cel |
SILICON |
DUAL |
R-CDFM-F2 |
BASE |
Not Qualified |
HIGH RELIABILITY |
|||||||||||||||
STMicroelectronics |
NPN |
SINGLE |
YES |
470 MHz |
29 W |
2.5 A |
METAL |
AMPLIFIER |
FLAT |
RECTANGULAR |
1 |
ULTRA HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
Other Transistors |
10 |
200 Cel |
24 pF |
SILICON |
25 V |
DUAL |
R-MDFM-F6 |
Not Qualified |
DIFFUSED EMITTER BALLAST RESISTOR |
||||||||||||||
|
STMicroelectronics |
NPN |
SINGLE |
YES |
145 W |
8 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
ROUND |
1 |
ULTRA HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
Other Transistors |
150 Cel |
SILICON |
16 V |
GOLD |
UNSPECIFIED |
O-PXFM-F6 |
Not Qualified |
DIFFUSED EMITTER BALLAST RESISTOR |
e4 |
RF Power Bipolar Junction Transistors (BJT) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.
RF Power BJTs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.
The RF Power BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.
RF Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.
Proper selection and use of RF Power BJTs are critical to ensure optimal performance, reliability, and compatibility with other components in the circuit. RF Power BJTs are often used in conjunction with other components, such as filters and matching networks, to form complete RF power amplification circuits.