Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Maximum Fall Time (tf) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
NPN |
SINGLE |
YES |
250 MHz |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
420 |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
LOW NOISE |
e3 |
||||||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
NO |
150 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
LOW NOISE |
TO-92 |
e3 |
||||||||||||||||||||
|
Continental Device India |
PNP |
SINGLE |
NO |
150 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
LOW NOISE |
TO-92 |
e3 |
||||||||||||||||||||
|
Nexperia |
PNP |
SINGLE |
YES |
100 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
220 |
150 Cel |
3 pF |
SILICON |
45 V |
-65 Cel |
DUAL |
R-PDSO-G3 |
AEC-Q101; IEC-60134 |
||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
.25 W |
100 |
150 Cel |
3.5 pF |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
TO-236AB |
e3 |
30 |
260 |
|||||||||||||||
|
Onsemi |
NPN |
YES |
100 MHz |
.5 W |
.1 A |
Other Transistors |
420 |
150 Cel |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
100 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
5 pF |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
TO-236AB |
e3 |
30 |
260 |
|||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
TO-236AB |
e3 |
30 |
260 |
||||||||||||||||
|
Onsemi |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
80 |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
AEC-Q101 |
||||||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 4.7 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
NXP Semiconductors |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
175 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||||
Infineon Technologies |
NPN |
SINGLE |
NO |
200 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
110 |
150 Cel |
SILICON |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
||||||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
110 |
150 Cel |
3 pF |
SILICON |
65 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
300 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
e3 |
30 |
260 |
||||||||||||||||||
|
NXP Semiconductors |
PNP |
SINGLE |
YES |
100 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.65 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
220 |
150 Cel |
5 pF |
SILICON |
65 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
250 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
ISOLATED |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||
|
Diotec Semiconductor Ag |
PNP |
SINGLE |
NO |
150 MHz |
.1 A |
PLASTIC/EPOXY |
WIRE |
ROUND |
1 |
3 |
CYLINDRICAL |
420 |
150 Cel |
SILICON |
45 V |
Matte Tin (Sn) - annealed |
BOTTOM |
O-PBCY-W3 |
1 |
Not Qualified |
TO-92 |
e3 |
10 |
260 |
|||||||||||||||||||||
|
Leshan Radio |
NPN |
YES |
.3 W |
.1 A |
1 |
BIP General Purpose Small Signal |
35 |
SILICON |
TIN |
1 |
e3 |
260 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
YES |
.3 W |
.1 A |
2 |
BIP General Purpose Small Signal |
30 |
SILICON |
TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
NO |
300 MHz |
1.5 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
200 |
150 Cel |
SILICON |
30 V |
TIN SILVER COPPER |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
e1 |
260 |
||||||||||||||||||||
|
Continental Device India |
PNP |
SINGLE |
NO |
150 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
200 |
150 Cel |
SILICON |
65 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
e3 |
|||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
NO |
150 MHz |
.625 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
200 |
150 Cel |
SILICON |
65 V |
MATTE TIN |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
e3 |
|||||||||||||||||||||
|
Infineon Technologies |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
130 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
50 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
|||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
.25 W |
100 |
150 Cel |
3.5 pF |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
TO-236AB |
e3 |
30 |
260 |
|||||||||||||||
|
Onsemi |
NPN |
YES |
.31 W |
.1 A |
1 |
BIP General Purpose Small Signal |
80 |
SILICON |
MATTE TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 21.36 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
150 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 10 |
e3 |
||||||||||||||||||||||||
|
Diodes Incorporated |
NPN |
SINGLE |
YES |
100 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
NO LEAD |
RECTANGULAR |
1 |
3 |
CHIP CARRIER |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBCC-N3 |
1 |
COLLECTOR |
Not Qualified |
HIGH RELIABILITY |
e4 |
30 |
260 |
||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
Tin (Sn) |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
TO-236AB |
e3 |
30 |
260 |
||||||||||||||||
|
Infineon Technologies |
NPN |
SINGLE |
YES |
250 MHz |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
420 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
e3 |
40 |
260 |
||||||||||||||||||||
|
Infineon Technologies |
PNP |
SINGLE |
YES |
250 MHz |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
220 |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
LOW NOISE |
e3 |
AEC-Q101 |
|||||||||||||||||||||||
|
Onsemi |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
80 |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 21 |
TO-236 |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
AEC-Q101 |
|||||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101; IEC-60134 |
||||||||||||||||
|
Infineon Technologies |
NPN |
SINGLE |
YES |
250 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
200 |
SILICON |
30 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
4.5 pF |
SILICON |
30 V |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
TO-236 |
e3 |
40 |
260 |
||||||||||||||||
|
Onsemi |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.31 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
40 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Diodes Incorporated |
NPN |
SINGLE |
YES |
300 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
30 V |
-65 Cel |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
HIGH RELIABILITY |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
100 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
6 |
SMALL OUTLINE |
Other Transistors |
110 |
150 Cel |
SILICON |
65 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
e3 |
30 |
260 |
IEC-134 |
||||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS |
YES |
100 MHz |
.5 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
200 |
150 Cel |
SILICON |
45 V |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||
|
Micro Commercial Components |
NPN |
SINGLE |
NO |
300 MHz |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
200 |
150 Cel |
SILICON |
65 V |
Matte Tin (Sn) |
BOTTOM |
O-PBCY-T3 |
1 |
Not Qualified |
TO-92 |
e3 |
10 |
260 |
||||||||||||||||||||
|
NXP Semiconductors |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
100 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||||
|
Diodes Incorporated |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
100 MHz |
.15 W |
.1 A |
PLASTIC/EPOXY |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
220 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
HIGH RELIABILITY |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
100 MHz |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
30 V |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
110 |
150 Cel |
3 pF |
SILICON |
30 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.
Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395