Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Maximum Fall Time (tf) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
250 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
ISOLATED |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.15 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
60 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-55 Cel |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 21 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Nexperia |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
100 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-55 Cel |
DUAL |
R-PDSO-G6 |
BUILT-IN BIAS RESISTOR RATIO IS 4.7 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
Toshiba |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
NO |
250 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
THROUGH-HOLE |
RECTANGULAR |
1 |
3 |
IN-LINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
6 pF |
SILICON |
50 V |
TIN LEAD |
SINGLE |
R-PSIP-T3 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e0 |
||||||||||||||||||||
|
Comchip Technology |
PNP |
SINGLE |
YES |
100 MHz |
.3 W |
1.5 A |
PLASTIC/EPOXY |
.5 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.3 W |
120 |
150 Cel |
SILICON |
25 V |
DUAL |
R-PDSO-G3 |
AEC-Q101 |
||||||||||||||||||||||||
|
Continental Device India |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
COLLECTOR |
Not Qualified |
TO-236AB |
e3 |
260 |
||||||||||||||||||
|
NXP Semiconductors |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
45 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
COLLECTOR |
Not Qualified |
TO-236AB |
e3 |
260 |
||||||||||||||||||
|
Diodes Incorporated |
PNP |
SINGLE |
YES |
200 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
220 |
150 Cel |
SILICON |
30 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
PNP |
YES |
100 MHz |
.3 W |
.1 A |
Other Transistors |
200 |
150 Cel |
TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
YES |
100 MHz |
.3 W |
.5 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
40 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
HIGH CURRENT DRIVER |
TO-236AB |
e3 |
30 |
260 |
|||||||||||||||||
|
Onsemi |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
150 Cel |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
40 |
260 |
|||||||||||||||||||
|
Onsemi |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.25 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
40 |
260 |
|||||||||||||||||
|
ROHM |
NPN |
COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.03 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
2 |
5 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
56 |
150 Cel |
SILICON |
50 V |
TIN SILVER COPPER |
DUAL |
R-PDSO-G5 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO 1 |
e1 |
10 |
260 |
||||||||||||||||||
|
ROHM |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
180 MHz |
.3 W |
.15 A |
PLASTIC/EPOXY |
AMPLIFIER |
.4 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
120 |
150 Cel |
SILICON |
50 V |
TIN SILVER COPPER |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
e1 |
10 |
260 |
||||||||||||||||||
|
Leshan Radio |
NPN |
YES |
.3 W |
.1 A |
1 |
BIP General Purpose Small Signal |
15 |
SILICON |
TIN |
1 |
e3 |
260 |
|||||||||||||||||||||||||||||||||
|
Leshan Radio |
NPN |
YES |
.3 W |
.1 A |
1 |
BIP General Purpose Small Signal |
80 |
SILICON |
TIN |
1 |
e3 |
260 |
|||||||||||||||||||||||||||||||||
|
Diodes Incorporated |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.5 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
100 |
150 Cel |
SILICON |
60 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
HIGH RELIABILITY |
e3 |
30 |
260 |
||||||||||||||||||
|
Micro Commercial Components |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.5 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
100 |
150 Cel |
SILICON |
60 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
e3 |
10 |
260 |
|||||||||||||||||||
|
Comchip Technology |
PNP |
SINGLE |
YES |
50 MHz |
.3 W |
.2 A |
PLASTIC/EPOXY |
.2 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.3 W |
60 |
150 Cel |
SILICON |
300 V |
DUAL |
R-PDSO-G3 |
HIGH RELIABILITY |
||||||||||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
YES |
50 MHz |
.3 W |
.5 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
25 |
150 Cel |
SILICON |
200 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
TO-236 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
PNP |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.25 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
80 |
150 Cel |
SILICON |
50 V |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
BUILT IN BIAS RESISTOR |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS |
YES |
250 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
ISOLATED |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||
|
NXP Semiconductors |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
175 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
200 |
150 Cel |
SILICON |
45 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
e3 |
30 |
260 |
|||||||||||||||||||
|
Philips Semiconductors |
PNP |
YES |
.3 W |
.1 A |
2 |
BIP General Purpose Small Signal |
30 |
SILICON |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
100 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
Nexperia |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.15 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101; IEC-60134 |
||||||||||||||||
Onsemi |
PNP |
SINGLE |
YES |
250 MHz |
.3 W |
.2 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
1 |
4 |
SMALL OUTLINE |
Other Transistors |
30 |
150 Cel |
SILICON |
40 V |
70 ns |
300 ns |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G4 |
1 |
COLLECTOR |
Not Qualified |
TO-261AA |
e0 |
30 |
235 |
|||||||||||||||||
|
Onsemi |
PNP |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
220 |
150 Cel |
SILICON |
65 V |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
TO-236AB |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
AEC-Q101 |
||||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
.3 W |
.2 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
20 |
150 Cel |
SILICON |
15 V |
12 ns |
18 ns |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
TO-236AB |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
AEC-Q101 |
|||||||||||||||||
|
Onsemi |
NPN |
SINGLE |
YES |
50 MHz |
.3 W |
.05 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
300 |
150 Cel |
SILICON |
30 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
TO-236AB |
e3 |
30 |
260 |
AEC-Q101 |
|||||||||||||||||||
|
NXP Semiconductors |
PNP |
SINGLE |
YES |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
.65 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
420 |
150 Cel |
SILICON |
30 V |
TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
LOW NOISE |
TO-236AB |
e3 |
30 |
260 |
||||||||||||||||
|
Comchip Technology |
NPN |
SINGLE |
YES |
100 MHz |
.3 W |
.5 A |
PLASTIC/EPOXY |
AMPLIFIER |
.25 V |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
.3 W |
100 |
150 Cel |
SILICON |
60 V |
DUAL |
R-PDSO-G3 |
HIGH RELIABILITY |
|||||||||||||||||||||||
|
Diodes Incorporated |
NPN |
DARLINGTON |
YES |
125 MHz |
.3 W |
.3 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
Other Transistors |
10000 |
150 Cel |
SILICON |
30 V |
MATTE TIN |
DUAL |
R-PDSO-G3 |
1 |
Not Qualified |
HIGH RELIABILITY |
e3 |
30 |
260 |
||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
YES |
.3 W |
.1 A |
2 |
BIP General Purpose Small Signal |
30 |
SILICON |
TIN |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
100 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
30 |
260 |
AEC-Q101; IEC-60134 |
||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
100 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
NPN |
SINGLE WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
1 |
3 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G3 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
AEC-Q101 |
||||||||||||||||||||
|
ROHM |
PNP |
SEPARATE, 2 ELEMENTS |
YES |
140 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
.5 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
Other Transistors |
120 |
150 Cel |
SILICON |
50 V |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
30 |
260 |
||||||||||||||||||||
|
NXP Semiconductors |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
ROHM |
NPN |
SINGLE |
NO |
180 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
.4 V |
THROUGH-HOLE |
RECTANGULAR |
1 |
3 |
IN-LINE |
Other Transistors |
.3 W |
120 |
125 Cel |
3.5 pF |
SILICON |
40 V |
Tin/Lead (Sn/Pb) |
SINGLE |
R-PSIP-T3 |
LOW NOISE |
e0 |
||||||||||||||||||||
Toshiba |
NPN |
SINGLE |
NO |
100 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
AMPLIFIER |
.3 V |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
200 |
125 Cel |
SILICON |
120 V |
Tin/Lead (Sn/Pb) |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
LOW NOISE |
TO-92 |
e0 |
||||||||||||||||||||
|
ROHM |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
250 MHz |
.3 W |
.07 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
68 |
150 Cel |
SILICON |
50 V |
TIN SILVER COPPER |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 4.7 |
e1 |
10 |
260 |
|||||||||||||||||
|
ROHM |
NPN |
COMMON EMITTER, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
250 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
2 |
5 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN SILVER COPPER |
DUAL |
R-PDSO-G5 |
1 |
Not Qualified |
DIGITAL |
e1 |
10 |
260 |
Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.
Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395