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| Manufacturer | 3m Electronic Products Division |
|---|---|
| Manufacturer's Part Number | 228-1277-00-0602J |
| Description | IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYSULFONE; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; |
| Datasheet | 228-1277-00-0602J Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Contact Finish (Mating): | Gold (30) over Nickel (50) |
| Other Names: |
2281277000602J JE150084109 5400733211 5113876534 54007332114 JE-1500-8410-9 80-6101-0432-7 2002803345-000006002 228-3345-00-0602 3M2802 80610104327 51138765347 7000007336 2266-228-1277-00-0602J |
| IC Socket Type: | IC Socket |
| Contact Finish (Termination): | Gold (30) over Nickel (50) |
| Housing Material: | Glass-Filled Polysulfone (PSU) |
| Device Type Used On: | DIP28 |
| Contact Material: | Beryllium Copper |
| Additional Features: | Standard: UL 94V-0 |
| JESD-609 Code: | e4 |
| No. of Contacts: | 28 |









