Mill-max Mfg - 115-43-308-41-003000

  1. Home
  2. Mill-max Mfg - 115-43-308-41-003000
115-43-308-41-003000 by Mill-max Mfg

Image shown is a representation only.

Manufacturer Mill-max Mfg
Manufacturer's Part Number 115-43-308-41-003000
Description IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 8; JESD-609 Code: e3;
Datasheet 115-43-308-41-003000 Datasheet
NAME DESCRIPTION
Other Names: ED90208
1154330841003000
IC Socket Type: IC Socket
Contact Config: Rectangle
Contact Finish (Termination): Matte Tin over Nickel
Housing Material: Polycyclohexylene Dimethylene Terephthalate (PCT)
Device Type Used On: DIP8
Additional Features: Low Profile
JESD-609 Code: e3
No. of Contacts: 8
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

2271028 by Phoenix Contact

2271028

Phoenix Contact

RELAY SOCKET;
XR2D-3204 by Omron

XR2D-3204

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
SS5-10-3.00-L-D-K-TR by Samtec

SS5-10-3.00-L-D-K-TR

Samtec

IC SOCKET;
304-13-104-41-770000 by Mill-max Mfg

304-13-104-41-770000

Mill-max Mfg

The Mill-max Mfg 304-13-104-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP4 devices with 4 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for various electronic applications.
350-10-117-00-001000 by Mill-max Mfg

350-10-117-00-001000

Mill-max Mfg

350-10-117-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP17 devices with 17 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
XR2A-0815 by Omron

XR2A-0815

Omron

IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
PYF14A-E by Omron

PYF14A-E

Omron

RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 4;
XR2A-1401-N by Omron

XR2A-1401-N

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
PF113A by Omron

PF113A

Omron

RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
2-640359-4 by TE Connectivity

2-640359-4

TE Connectivity

TE Connectivity's 2-640359-4 is a Chip Carrier IC Socket with 18 contacts, made of Phosphor Bronze with Gold finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for DIP18 devices, it features a rectangular contact pattern and glass-filled polyethylene housing material.
2-1571552-3 by TE Connectivity

2-1571552-3

TE Connectivity

TE Connectivity's 2-1571552-3 is a Chip Carrier IC Socket with PCB contact row spacing of 7.62mm and rectangular pattern. Made of thermoplastic polyester, it has 14 contacts, operates b/w -55°C to 105°C, and supports devices like DIP14. With solder termination, it offers a current rating of 3A and dielectric voltage withstand of 1400VAC.
8501NR52B by Schneider Electric Sa

8501NR52B

Schneider Electric Sa

RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
HLS-1204-TT-31 by Samtec

HLS-1204-TT-31

Samtec

The Samtec HLS-1204-TT-31 is a POLYETHYLENE chip carrier socket for PGA48 devices with 48 contacts. It features Tin contact finish for mating and Tin (Sn) with Nickel (Ni) barrier for termination. Ideal for IC applications requiring reliable connections in electronic assemblies.
HLT-1712-G-H by Samtec

HLT-1712-G-H

Samtec

Samtec's HLT-1712-G-H is a plastic chip carrier socket with 204 brass contacts. It features gold over nickel contact finish for PGA204 devices. Ideal for IC sockets, this component offers reliable connections in electronic applications.
XR2A-2802 by Omron

XR2A-2802

Omron

IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD;
818-22-024-10-002101 by Mill-max Mfg

818-22-024-10-002101

Mill-max Mfg

IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
XR2A-6402 by Omron

XR2A-6402

Omron

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2A;
115-47-632-41-001000 by Mill-max Mfg

115-47-632-41-001000

Mill-max Mfg

IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Termination): TIN; Contact Material: NOT SPECIFIED;
IC-306-WGT by Samtec

IC-306-WGT

Samtec

IC-306-WGT by Samtec is a Chip Carrier IC Socket with 6 contacts. It features Beryllium Copper contact material, Gold finish for mating, and Tin over Nickel/Copper termination. This rectangular socket is made of Polyester and designed for DIP6 devices.
ICO-308-NGG by Samtec

ICO-308-NGG

Samtec

The Samtec ICO-308-NGG is a Chip Carrier IC Socket with 8 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It uses beryllium copper for contacts, gold finish over nickel for mating, and operates b/w -65°C to 125°C. Ideal for DIP8 devices, it has a current rating of 1A and dielectric voltage withstand of 1000VAC.