Analog Devices - ADSP-CM419F-BCZENG

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ADSP-CM419F-BCZENG by Analog Devices

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Manufacturer Analog Devices
Manufacturer's Part Number ADSP-CM419F-BCZENG
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 210; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet ADSP-CM419F-BCZENG Datasheet
In Stock650
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: NO
Maximum Seated Height: 1.5 mm
Surface Mount: YES
No. of Terminals: 210
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Address Bus Width: 0
Technology: CMOS
JESD-30 Code: S-PBGA-B210
Maximum Clock Frequency: 60 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 15 mm
Speed: 240 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 0
Minimum Operating Temperature: -40 Cel
Length: 15 mm
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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