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| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | ADSP-CM419F-BCZENG |
| Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 210; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | ADSP-CM419F-BCZENG Datasheet |
| In Stock | 853 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Integrated Cache: | NO |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| No. of Terminals: | 210 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Address Bus Width: | 0 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B210 |
| Maximum Clock Frequency: | 60 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | LFBGA |
| Width: | 15 mm |
| Speed: | 240 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 0 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 15 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |









