Broadcom - BCM5346

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BCM5346 by Broadcom

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Manufacturer Broadcom
Manufacturer's Part Number BCM5346
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: UNSPECIFIED; Technology: CMOS;
Datasheet BCM5346 Datasheet
In Stock235
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Surface Mount: YES
No. of Terminals: 676
Qualification: Not Qualified
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: X-PBGA-B676
Package Shape: UNSPECIFIED
Terminal Form: BALL
Package Code: BGA
Moisture Sensitivity Level (MSL): 1
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