Broadcom - BCM5850

  1. Home
  2. Broadcom - BCM5850
BCM5850 by Broadcom

Image shown is a representation only.

Manufacturer Broadcom
Manufacturer's Part Number BCM5850
Description Other uPs/uCs/Peripheral ICs;
Datasheet BCM5850 Datasheet
In Stock92
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
92 - -

Popular Products

Category Top Products

TMS320DM6446AZWTA by Texas Instruments

TMS320DM6446AZWTA

Texas Instruments

TMS320DM6446AZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features I2C, SPI, UART, USB compatibility and operates in temperatures ranging from -40 to 105°C.
ESP32-WROOM-32E-H4 by Espressif Systems (Shanghai)

ESP32-WROOM-32E-H4

Espressif Systems (Shanghai)

ESP32-WROOM-32E-H4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact size (25.5mm x 18mm) and peak reflow temp of 250C.
BGM13S22F512GA-V3R by Silicon Labs

BGM13S22F512GA-V3R

Silicon Labs

SoC;
MIMXRT1042XFP5B by NXP Semiconductors

MIMXRT1042XFP5B

NXP Semiconductors

SYSTEM ON CHIP;
EFR32MG21A020F1024IM32-B by Silicon Labs

EFR32MG21A020F1024IM32-B

Silicon Labs

EFR32MG21A020F1024IM32-B by Silicon Labs is a 32-terminal, CMOS System on Chip with a supply voltage range of 1.71V to 3.8V. Ideal for automotive applications, it operates b/w -40°C to 125°C and features a compact square package style with matte tin finish for surface mount assembly.
CC1310F32RGZT by Texas Instruments

CC1310F32RGZT

Texas Instruments

CC1310F32RGZT by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. It operates at -40 to 85 °C, with a supply voltage range of 1.8V to 3.8V. Ideal for industrial applications requiring a MICROPROCESSOR CIRCUIT in a compact, surface-mountable package style.
XCZU3EG-1SFVA625E by Xilinx

XCZU3EG-1SFVA625E

Xilinx

XCZU3EG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 625 terminals in a GRID ARRAY package style. With supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance computing in various industries.
USB4640-HZH-03 by Microchip Technology

USB4640-HZH-03

Microchip Technology

USB4640-HZH-03 by Microchip Technology is a CMOS microprocessor circuit with 48 terminals, operating at up to 24 MHz. It has a supply voltage range of 1.1V to 1.3V and operates in commercial temperature grades from 0°C to 70°C. This chip carrier package is suitable for various applications requiring a low-profile, high-frequency peripheral IC solution.
MCIMX6Q5EYM10AD by Freescale Semiconductor

MCIMX6Q5EYM10AD

Freescale Semiconductor

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
SLB9670XQ20FW762XUMA1 by Infineon Technologies

SLB9670XQ20FW762XUMA1

Infineon Technologies

SLB9670XQ20FW762XUMA1 by Infineon Technologies is a cryptographic authenticator with CMOS technology. It has a package style of chip carrier, heat sink/slug, and very thin profile. With a max supply voltage of 1.95V, it is suitable for industrial applications requiring secure authentication.
NT3H2111W0FTTJ by NXP Semiconductors

NT3H2111W0FTTJ

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30;
SCANSTA112SM/NOPB by National Semiconductor

SCANSTA112SM/NOPB

National Semiconductor

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;
D2-92633-LR by Intersil

D2-92633-LR

Intersil

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: SQUARE;
XC7Z035-1FBG676C by Xilinx

XC7Z035-1FBG676C

Xilinx

The Xilinx XC7Z035-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 676 terminals in a square grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.
AM6234ATCGHAALW by Texas Instruments

AM6234ATCGHAALW

Texas Instruments

AM6234ATCGHAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring fine pitch and low profile components.
MCIMX6X1AVO08AB by NXP Semiconductors

MCIMX6X1AVO08AB

NXP Semiconductors

MCIMX6X1AVO08AB by NXP Semiconductors is a System on Chip with 400 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.275V to 1.5V and uses CMOS technology. Ideal for automotive applications due to its low profile, fine pitch grid array package style.
10AS066N3F40E2LG by Intel

10AS066N3F40E2LG

Intel

The Intel 10AS066N3F40E2LG is a Peripheral IC with SoC technology. It operates b/w 0-100°C, with supply voltage range of 0.87-0.93V. With 1517 terminals in a GRID ARRAY package style, it's ideal for applications requiring high performance and integration in compact spaces.
ESP32-S3-WROOM-1-N16R2 by Espressif Systems (Shanghai)

ESP32-S3-WROOM-1-N16R2

Espressif Systems (Shanghai)

ESP32-S3-WROOM-1-N16R2 by Espressif Systems (Shanghai) is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package and surface mount capability.
VS3674UNION by Texas Instruments

VS3674UNION

Texas Instruments

VS3674UNION by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 338 terminals in a GRID ARRAY package style, suitable for applications requiring low profile and fine pitch components. With a supply voltage range of 1.28V to 1.42V and operating temperature from 0°C to 85°C, it offers versatility in various electronic designs.
XCZU1EG-2SFVA625E by Xilinx

XCZU1EG-2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);