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| Manufacturer | Everspin Technologies |
|---|---|
| Manufacturer's Part Number | EMD3D256M08G1-150CBS1R |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED; |
| Datasheet | EMD3D256M08G1-150CBS1R Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32MX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 1.425 V |
| Surface Mount: | YES |
| No. of Terminals: | 78 |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B78 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 10 mm |
| Memory Density: | 268435456 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Length: | 13 mm |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 1.5 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 1.575 V |
