MR25H128APDF by Everspin Technologies | Memory ICs

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Manufacturer	Everspin Technologies
Manufacturer's Part Number	MR25H128APDF
Description	EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
Datasheet	MR25H128APDF Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	16KX8
Maximum Seated Height:	.9 mm
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	8
Maximum Clock Frequency (fCLK):	40 MHz
No. of Words:	16384 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	R-PDSO-N8
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	HVSON
Width:	5 mm
Moisture Sensitivity Level (MSL):	3
Serial Bus Type:	SPI
Memory Density:	131072 bit
Memory IC Type:	EEPROM
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Length:	6 mm
No. of Words Code:	16K
Nominal Supply Voltage / Vsup (V):	3
Parallel or Serial:	SERIAL
Terminal Pitch:	1.27 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V

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