FEMC032GTTE7-T13-26 by Flexxon Global | Memory ICs

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Manufacturer	Flexxon Global
Manufacturer's Part Number	FEMC032GTTE7-T13-26
Description	FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 100; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Type: MLC NAND TYPE;
Datasheet	FEMC032GTTE7-T13-26 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Memory Density:	274877906944 bit
Organization:	32GX8
Surface Mount:	YES
Memory IC Type:	FLASH CARD
Minimum Operating Temperature:	-25 Cel
Memory Width:	8
No. of Functions:	1
No. of Terminals:	100
Type:	MLC NAND TYPE
No. of Words:	34359738368 words
Terminal Position:	BOTTOM
Screening Level:	AEC-Q100; TS 16949
Technology:	CMOS
No. of Words Code:	32G
JESD-30 Code:	R-PBGA-B100
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Nominal Supply Voltage / Vsup (V):	3.3
Maximum Operating Temperature:	85 Cel
Temperature Grade:	OTHER

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