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| Manufacturer | Freescale Semiconductor |
|---|---|
| Manufacturer's Part Number | MCIMX6S7CVM08AC |
| Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1; |
| Datasheet | MCIMX6S7CVM08AC Datasheet |
| In Stock | 386 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 624 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B624 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | LFBGA |
| Width: | 21 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: | 935311754557 |
| Speed: | 800 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| JESD-609 Code: | e1 |
| Length: | 21 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |









