Freescale Semiconductor - MCIMX6S7CVM08AC

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MCIMX6S7CVM08AC by Freescale Semiconductor

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Manufacturer Freescale Semiconductor
Manufacturer's Part Number MCIMX6S7CVM08AC
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
Datasheet MCIMX6S7CVM08AC Datasheet
In Stock386
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.5 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 624
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Package Code: LFBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Speed: 800 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Low Power Mode: YES
Boundary Scan: YES
JESD-609 Code: e1
Length: 21 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
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