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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | MPC8308CVMAGD |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | MPC8308CVMAGD Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.54 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
No. of Terminals: | 473 |
No. of Serial I/Os: | 2 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B473 |
Maximum Clock Frequency: | 66.67 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | LFBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 400 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA473,23X23,32 |
Length: | 19 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1,1.8,2.5/3.3 |