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Manufacturer | Holt Integrated Circuits |
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Manufacturer's Part Number | HI-2130GBIF |
Description | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 121; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | HI-2130GBIF Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 5.2 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
Data Encoding or Decoding Method: | BIPH-LEVEL(MANCHESTER) |
No. of Terminals: | 121 |
No. of Serial I/Os: | 2 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 16 |
Maximum Data Transfer Rate: | .125 MBps |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B121 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 16.3 mm |
Moisture Sensitivity Level (MSL): | 1 |
Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
Low Power Mode: | NO |
Boundary Scan: | NO |
External Data Bus Width: | 16 |
Communication Protocol: | MIL-STD-1553A; MIL-STD-1553B; MIL-STD-1760 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Length: | 16.3 mm |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | SPI |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |