Infineon Technologies - BGA777L7E6327XTSA1

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BGA777L7E6327XTSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGA777L7E6327XTSA1
Description RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR;
Datasheet BGA777L7E6327XTSA1 Datasheet
In Stock35
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 2.8 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Telecom IC Type: RF AND BASEBAND CIRCUIT
Maximum Seated Height: .5 mm
Surface Mount: YES
Minimum Operating Temperature: -30 Cel
No. of Functions: 1
No. of Terminals: 6
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 2 mm
JESD-30 Code: R-XBCC-B6
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): NOT SPECIFIED
Package Code: HVBCC
Width: 1.3 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
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Pricing (USD)

Qty. Unit Price Ext. Price
35 $0.361 $12.635

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