Infineon Technologies - BSB027P03LX3G

BSB027P03LX3G by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BSB027P03LX3G
Description P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 78 W; Terminal Position: BOTTOM; Package Style (Meter): CHIP CARRIER;
Datasheet BSB027P03LX3G Datasheet
In Stock412
NAME DESCRIPTION
Package Body Material: METAL
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 27 A
Maximum Pulsed Drain Current (IDM): 400 A
Sub-Category: Other Transistors
Surface Mount: YES
No. of Terminals: 3
Maximum Power Dissipation (Abs): 78 W
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
JESD-30 Code: R-MBCC-N3
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Case Connection: DRAIN
Maximum Drain-Source On Resistance: .0027 ohm
Avalanche Energy Rating (EAS): 290 mJ
Polarity or Channel Type: P-CHANNEL
Minimum DS Breakdown Voltage: 30 V
Qualification: Not Qualified
Maximum Drain Current (Abs) (ID): 142 A
Peak Reflow Temperature (C): NOT SPECIFIED
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Pricing (USD)

Qty. Unit Price Ext. Price
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