Infineon Technologies - BSF073NE2LQG

BSF073NE2LQG by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BSF073NE2LQG
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 28 W; Maximum Drain Current (Abs) (ID): 50 A; Operating Mode: ENHANCEMENT MODE;
Datasheet BSF073NE2LQG Datasheet
In Stock783
NAME DESCRIPTION
Package Body Material: METAL
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 14 A
Maximum Pulsed Drain Current (IDM): 200 A
Sub-Category: FET General Purpose Power
Surface Mount: YES
No. of Terminals: 2
Maximum Power Dissipation (Abs): 28 W
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
JESD-30 Code: R-MBCC-N2
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Case Connection: DRAIN
Maximum Drain-Source On Resistance: .0142 ohm
Avalanche Energy Rating (EAS): 30 mJ
Polarity or Channel Type: N-CHANNEL
Minimum DS Breakdown Voltage: 25 V
Qualification: Not Qualified
Maximum Drain Current (Abs) (ID): 50 A
Peak Reflow Temperature (C): NOT SPECIFIED
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Pricing (USD)

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