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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CY7C4022KV13-933FCXC |
| Description | QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 361; Package Code: HBGA; Package Shape: SQUARE; Memory Width: 18; |
| Datasheet | CY7C4022KV13-933FCXC Datasheet |
| In Stock | 545 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 4MX18 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 2.765 mm |
| Minimum Supply Voltage (Vsup): | 1.26 V |
| Surface Mount: | YES |
| No. of Terminals: | 361 |
| No. of Words: | 4194304 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B361 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | HBGA |
| Width: | 21 mm |
| Memory Density: | 75497472 bit |
| Memory IC Type: | QDR SRAM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| No. of Functions: | 1 |
| Length: | 21 mm |
| No. of Words Code: | 4M |
| Nominal Supply Voltage / Vsup (V): | 1.3 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 1.34 V |
