Infineon Technologies - CY8C20747-24FDXC

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CY8C20747-24FDXC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY8C20747-24FDXC
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 30; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet CY8C20747-24FDXC Datasheet
In Stock139
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 4 mA
Terminal Finish: TIN SILVER
No. of Terminals: 30
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B30
Package Shape: RECTANGULAR
ROM Words: 16384
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Speed: 25.2 rpm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 5.5 V
RAM Bytes: 1024
Bit Size: 8
JESD-609 Code: e2
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA30,5X6,14
ROM Programmability: FLASH
Terminal Pitch: .35 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8/5
CPU Family: M8C
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