Infineon Technologies - CYD18S18V18-167BBXC

CYD18S18V18-167BBXC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CYD18S18V18-167BBXC
Description MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,40;
Datasheet CYD18S18V18-167BBXC Datasheet
In Stock395
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .3 Amp
Organization: 1MX18
Output Characteristics: 3-STATE
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.7 mm
Minimum Supply Voltage (Vsup): 1.42 V
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 690 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 256
Maximum Clock Frequency (fCLK): 167 MHz
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LBGA
Width: 19 mm
Moisture Sensitivity Level (MSL): 3
Input/Output Type: COMMON
No. of Ports: 2
Memory Density: 18874368 bit
Minimum Standby Voltage: 1.4 V
Memory IC Type: MULTI-PORT SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 18
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA256,16X16,40
Length: 19 mm
Maximum Access Time: 11 ns
No. of Words Code: 1M
Nominal Supply Voltage / Vsup (V): 1.5
Additional Features: PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.58 V
Power Supplies (V): 1.5/1.8
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Pricing (USD)

Qty. Unit Price Ext. Price
395 - -

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