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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CYW43455XKUBGT |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 140; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA140,11X13,16; |
| Datasheet | CYW43455XKUBGT Datasheet |
| In Stock | 762 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .6 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 140 |
| Package Equivalence Code: | BGA140,11X13,16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Data Rate: | 433.3 Mbps |
| Length: | 5.27 mm |
| JESD-30 Code: | R-PBGA-B140 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 4.47 mm |
| Terminal Pitch: | .4 mm |
| Moisture Sensitivity Level (MSL): | 1 |
