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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CYW54907KWBGT |
| Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 316; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; |
| Datasheet | CYW54907KWBGT Datasheet |
| In Stock | 547 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Supply Voltage: | 1.26 V |
| Maximum Seated Height: | .33 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 316 |
| Package Equivalence Code: | BGA316(UNSPEC) |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Length: | 5.848 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B316 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Additional Features: | MINIMUM BUMP PITCH IS CONSIDERED |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VFBGA |
| Width: | 4.907 mm |
| Terminal Pitch: | .2 mm |
