Infineon Technologies - CYWB0125ABX-FDXI

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CYWB0125ABX-FDXI by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CYWB0125ABX-FDXI
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: VFBGA; Package Shape: SQUARE;
Datasheet CYWB0125ABX-FDXI Datasheet
In Stock961
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Seated Height: .55 mm
Sub-Category: Bus Controllers
Surface Mount: YES
Maximum Supply Current: 115 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 81
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B81
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 3.784 mm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.9 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA81,9X9,16
Length: 3.788 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8,1.8/3.3
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Pricing (USD)

Qty. Unit Price Ext. Price
961 $13.890 $13,348.290

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