Infineon Technologies - CYWB0226ABSX-FDXI

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CYWB0226ABSX-FDXI by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CYWB0226ABSX-FDXI
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet CYWB0226ABSX-FDXI Datasheet
In Stock522
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: .55 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 81
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B81
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 3.907 mm
Moisture Sensitivity Level (MSL): 1
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.9 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 3.91 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
522 $8.330 $4,348.260

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