Infineon Technologies - FF11MR12W1M1_B70

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FF11MR12W1M1_B70 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number FF11MR12W1M1_B70
Description N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR; Surface Mount: NO; Maximum Power Dissipation (Abs): .02 W; Transistor Element Material: SILICON CARBIDE; Package Shape: RECTANGULAR;
Datasheet FF11MR12W1M1_B70 Datasheet
In Stock403
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
Transistor Element Material: SILICON CARBIDE
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Feedback Capacitance (Crss): 56 pF
Polarity or Channel Type: N-CHANNEL
Surface Mount: NO
Minimum Operating Temperature: -40 Cel
No. of Terminals: 9
Minimum DS Breakdown Voltage: 1200 V
Maximum Power Dissipation (Abs): .02 W
Terminal Position: UPPER
Package Style (Meter): FLANGE MOUNT
JESD-30 Code: R-XUFM-X9
No. of Elements: 2
Package Shape: RECTANGULAR
Terminal Form: UNSPECIFIED
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Case Connection: ISOLATED
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