Infineon Technologies - FP30D250E

  1. Home
  2. Infineon Technologies - FP30D250E
FP30D250E by Infineon Technologies

Image shown is a representation only.

Manufacturer Infineon Technologies
Manufacturer's Part Number FP30D250E
Description Other uPs/uCs/Peripheral ICs;
Datasheet FP30D250E Datasheet
In Stock520
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
520 - -

Popular Products

Category Top Products

LTC4263IDE#PBF by Linear Technology

LTC4263IDE#PBF

Linear Technology

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;
AX88772BLI by Asix Electronics

AX88772BLI

Asix Electronics

Other uPs/uCs/Peripheral ICs;
MSP430F67791AIPZ by Texas Instruments

MSP430F67791AIPZ

Texas Instruments

MSP430F67791AIPZ by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels, 32 RAM words, and 524288 ROM words. It operates at a max frequency of 0.032768 MHz and has various peripherals like BOR, DMA(3), RTC, TIMER(4). Ideal for industrial applications requiring low power consumption and high performance.
BGM13P32F512GA-V2 by Silicon Labs

BGM13P32F512GA-V2

Silicon Labs

SoC;
MCIMX351AJQ5C by NXP Semiconductors

MCIMX351AJQ5C

NXP Semiconductors

MCIMX351AJQ5C by NXP Semiconductors is a multifunction peripheral IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.33V to 1.47V. This low-profile, fine-pitch grid array package is ideal for industrial applications requiring high performance in compact spaces.
XCZU25DR-2FFVE1156E by Xilinx

XCZU25DR-2FFVE1156E

Xilinx

The Xilinx XCZU25DR-2FFVE1156E is a programmable SoC with CMOS technology. It features 1156 terminals in a grid array package style, operating b/w 0 to 100°C. With a supply voltage range of 0.825V to 0.876V, it's ideal for various applications requiring high-performance processing capabilities.
MCIMX6L8DVN10AA by Freescale Semiconductor

MCIMX6L8DVN10AA

Freescale Semiconductor

SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B432;
MCIMX6Y1CVM05AB by NXP Semiconductors

MCIMX6Y1CVM05AB

NXP Semiconductors

MCIMX6Y1CVM05AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C, with supply voltage ranging from 1.275V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
XCZU9EG-2FFVB1156E by Xilinx

XCZU9EG-2FFVB1156E

Xilinx

The Xilinx XCZU9EG-2FFVB1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance computing and signal processing capabilities.
MCIMX535DVV2C by Freescale Semiconductor

MCIMX535DVV2C

Freescale Semiconductor

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
XC7Z030-2FBG484E by Xilinx

XC7Z030-2FBG484E

Xilinx

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.
MKW41Z512VHT4 by NXP Semiconductors

MKW41Z512VHT4

NXP Semiconductors

The NXP Semiconductors MKW41Z512VHT4 is a CMOS microprocessor circuit with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.71 to 3.6 V. Ideal for industrial applications requiring high-performance uPs and uCs in surface-mount configurations.
MSP430F6779AIPZR by Texas Instruments

MSP430F6779AIPZR

Texas Instruments

MSP430F6779AIPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, BOR, DMA(3), RTC, TIMER(4), WDT peripherals for industrial applications. Operating at up to 0.032768 MHz clock frequency, it offers I2C(2), IRDA(4), SPI(6), UART(4) connectivity options.
1433 by Ndk America

1433

Ndk America

Other uPs/uCs/Peripheral ICs;
ATECC608B-MAHDA-S by Microchip Technology

ATECC608B-MAHDA-S

Microchip Technology

Microchip ATECC608B-MAHDA-S is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85 °C, supports 2-5.5 V supply voltage range, and comes in a small outline package suitable for industrial applications.
XCZU3EG-1SFVC784E by Xilinx

XCZU3EG-1SFVC784E

Xilinx

XCZU3EG-1SFVC784E by Xilinx is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and processing capabilities.
XC7Z035-3FFG900E by Xilinx

XC7Z035-3FFG900E

Xilinx

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6S7CVM08ACR by NXP Semiconductors

MCIMX6S7CVM08ACR

NXP Semiconductors

MCIMX6S7CVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.275V to 1.5V. Ideal for applications requiring low profile and fine pitch package style.
LS1021ASN7KQB by NXP Semiconductors

LS1021ASN7KQB

NXP Semiconductors

LS1021ASN7KQB by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 525 terminals in a GRID ARRAY package. It operates at 0.97-1.03 V and features TIN SILVER COPPER terminal finish. Ideal for applications requiring high performance in a compact form factor.
MCIMX283CVM4B by NXP Semiconductors

MCIMX283CVM4B

NXP Semiconductors

MCIMX283CVM4B by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.35-1.55 V. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.