HYB25D128800CF-5 by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	HYB25D128800CF-5
Description	DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet	HYB25D128800CF-5 Datasheet
In Stock	475

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	16MX8
Maximum Seated Height:	1.2 mm
Access Mode:	FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup):	2.5 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	60
No. of Words:	16777216 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B60
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	TBGA
Width:	8 mm
No. of Ports:	1
Memory Density:	134217728 bit
Self Refresh:	YES
Memory IC Type:	DDR1 DRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Length:	12 mm
Maximum Access Time:	.5 ns
No. of Words Code:	16M
Nominal Supply Voltage / Vsup (V):	2.6
Additional Features:	AUTO/SELF REFRESH
Terminal Pitch:	1 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	2.7 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
475	-	-

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