Infineon Technologies - HYB39M93200L166

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HYB39M93200L166 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB39M93200L166
Description SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn/Pb);
Datasheet HYB39M93200L166 Datasheet
In Stock885
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .001 Amp
Organization: 288KX32
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
Maximum Supply Current: 195 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 68
Maximum Clock Frequency (fCLK): 166 MHz
No. of Words: 294912 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: CMOS
JESD-30 Code: S-PQCC-J68
Package Shape: SQUARE
Terminal Form: J BEND
Maximum Operating Temperature: 70 Cel
Package Code: QCCJ
Input/Output Type: COMMON
Memory Density: 9437184 bit
Memory IC Type: SYNCHRONOUS DRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 32
Qualification: Not Qualified
Package Equivalence Code: LDCC68,1.0SQ
No. of Words Code: 288K
Nominal Supply Voltage / Vsup (V): 3.3
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3
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