Infineon Technologies - IRF8910PBF-1

IRF8910PBF-1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number IRF8910PBF-1
Description N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Minimum Operating Temperature: -55 Cel; Moisture Sensitivity Level (MSL): 1;
Datasheet IRF8910PBF-1 Datasheet
In Stock136
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Drain Current (ID): 10 A
Maximum Pulsed Drain Current (IDM): 82 A
Surface Mount: YES
No. of Terminals: 8
Maximum Power Dissipation (Abs): 2 W
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G8
No. of Elements: 2
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 150 Cel
Maximum Power Dissipation Ambient: 1.3 W
Maximum Drain-Source On Resistance: .0134 ohm
Moisture Sensitivity Level (MSL): 1
Avalanche Energy Rating (EAS): 19 mJ
Maximum Feedback Capacitance (Crss): 160 pF
JEDEC-95 Code: MS-012AA
Polarity or Channel Type: N-CHANNEL
Minimum Operating Temperature: -55 Cel
Minimum DS Breakdown Voltage: 20 V
Maximum Drain Current (Abs) (ID): 10 A
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