Infineon Technologies - PEB31666V1.3

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PEB31666V1.3 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number PEB31666V1.3
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
Datasheet PEB31666V1.3 Datasheet
In Stock761
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Seated Height: 2.45 mm
Sub-Category: Other Telecom ICs
Surface Mount: YES
Maximum Supply Current: .125 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 64
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G64
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: QFP
Width: 14 mm
Telecom IC Type: TELECOM CIRCUIT
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: QFP64,.66SQ,32
Length: 14 mm
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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