S29AS008J70LFI033 by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	S29AS008J70LFI033
Description	FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 45; Package Code: FBGA; Package Shape: RECTANGULAR; Package Equivalence Code: BGA45,9X11,16/8;
Datasheet	S29AS008J70LFI033 Datasheet
In Stock	831

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	512KX16
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	30 mA
Command User Interface:	YES
No. of Terminals:	45
No. of Words:	524288 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B45
No. of Sectors/Size:	8,15
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	FBGA
Boot Block:	TOP
Memory Density:	8388608 bit
Sector Size (Words):	8K,64K
Toggle Bit:	YES
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA45,9X11,16/8
Alternate Memory Width:	8
Common Flash Interface:	YES
Maximum Access Time:	70 ns
No. of Words Code:	512K
Nominal Supply Voltage / Vsup (V):	1.8
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.2 mm
Temperature Grade:	INDUSTRIAL
Data Polling:	YES
Power Supplies (V):	1.8

Pricing (USD)

Qty.	Unit Price	Ext. Price
831	-	-

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