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| Manufacturer | Winbond Electronics |
|---|---|
| Manufacturer's Part Number | W25Q64JVTBIQ |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Words: 8388608 words; |
| Datasheet | W25Q64JVTBIQ Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00005 Amp |
| Organization: | 8MX8 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.2 mm |
| Programming Voltage (V): | 3.3 |
| Minimum Supply Voltage (Vsup): | 3 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 25 mA |
| No. of Terminals: | 24 |
| Maximum Clock Frequency (fCLK): | 133 MHz |
| No. of Words: | 8388608 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | TBGA |
| Width: | 6 mm |
| Serial Bus Type: | SPI |
| Other Names: | 256-W25Q64JVTBIQ |
| Memory Density: | 67108864 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Package Equivalence Code: | BGA24,5X5,40 |
| Alternate Memory Width: | 1 |
| Length: | 8 mm |
| No. of Words Code: | 8M |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | IT ALSO OPERATES AT 2.7V @ 104MHZ |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
