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Manufacturer | Infineon Technologies |
---|---|
Manufacturer's Part Number | S29GL512S12GHBV13 |
Description | FLASH; No. of Terminals: 56; Package Code: VFBGA; Package Shape: RECTANGULAR; Organization: 64MX8; Alternate Memory Width: 1; |
Datasheet | S29GL512S12GHBV13 Datasheet |
In Stock | 659 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Programming Voltage (V): | 3 |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
Screening Level: | AEC-Q100; TS 16949 |
Technology: | CMOS |
No. of Sectors/Size: | 512 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | ASYNCHRONOUS |
Package Code: | VFBGA |
Toggle Bit: | YES |
Memory Width: | 8 |
Package Equivalence Code: | BGA56,8X8,32 |
Alternate Memory Width: | 1 |
Additional Features: | 20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES |
Minimum Data Retention Time: | 2 |
Ready or Busy: | YES |
Terminal Pitch: | .8 mm |
Maximum Standby Current: | .0002 Amp |
Organization: | 64MX8 |
Output Characteristics: | 3-STATE |
Maximum Seated Height: | 1 mm |
Maximum Supply Current: | 100 mA |
Command User Interface: | YES |
No. of Terminals: | 56 |
No. of Words: | 67108864 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-PBGA-B56 |
Maximum Operating Temperature: | 105 Cel |
Endurance: | 100000 Write/Erase Cycles |
Width: | 7 mm |
Boot Block: | BOTTOM/TOP |
Memory Density: | 536870912 bit |
Sector Size (Words): | 128K |
Memory IC Type: | FLASH |
Minimum Operating Temperature: | -40 Cel |
Page Size (words): | 32 |
No. of Functions: | 1 |
Type: | NAND TYPE |
Common Flash Interface: | YES |
Length: | 9 mm |
Maximum Access Time: | 120 ns |
No. of Words Code: | 64M |
Nominal Supply Voltage / Vsup (V): | 3 |
Parallel or Serial: | PARALLEL |
Maximum Supply Voltage (Vsup): | 3.6 V |
Data Polling: | YES |