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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | S71WS256PD0HF3HL0 |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: FBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; |
| Datasheet | S71WS256PD0HF3HL0 Datasheet |
| In Stock | 788 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 84 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B84 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Mixed Memory Type: | FLASH+PSRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -25 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA84,10X12,32 |
| Maximum Access Time: | 80 ns |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.8 |
