IS22TF32G-JCLA2 by Integrated Silicon Solution | Memory ICs

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Manufacturer	Integrated Silicon Solution
Manufacturer's Part Number	IS22TF32G-JCLA2
Description	FLASH; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Memory Density: 274877906944 bit;
Datasheet	IS22TF32G-JCLA2 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00003 Amp
Organization:	32GX8
Output Characteristics:	3-STATE
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1 mm
Programming Voltage (V):	3.3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
Maximum Supply Current:	55 mA
No. of Terminals:	153
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	34359738368 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Screening Level:	AEC-Q100
Write Protection:	HARDWARE/SOFTWARE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B153
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	105 Cel
Package Code:	VFBGA
Width:	11.5 mm
Memory Density:	274877906944 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Type:	TLC NAND TYPE
Package Equivalence Code:	BGA153,14X14,20
Length:	13 mm
No. of Words Code:	32G
Nominal Supply Voltage / Vsup (V):	3.3
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	SERIAL
Terminal Pitch:	.5 mm
Maximum Supply Voltage (Vsup):	3.6 V

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