Integrated Silicon Solution - IS43LD32640B-18BLI-TR

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IS43LD32640B-18BLI-TR by Integrated Silicon Solution

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Manufacturer Integrated Silicon Solution
Manufacturer's Part Number IS43LD32640B-18BLI-TR
Description LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 134; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
Datasheet IS43LD32640B-18BLI-TR Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX32
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.1 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.14 V
Surface Mount: YES
No. of Terminals: 134
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B134
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 10 mm
No. of Ports: 1
Memory Density: 2147483648 bit
Self Refresh: YES
Memory IC Type: LPDDR2 DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 32
No. of Functions: 1
Length: 11.5 mm
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.2
Additional Features: SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.3 V
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