Integrated Silicon Solution - IS43TR16128C-15HBL

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IS43TR16128C-15HBL by Integrated Silicon Solution

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Manufacturer Integrated Silicon Solution
Manufacturer's Part Number IS43TR16128C-15HBL
Description DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet IS43TR16128C-15HBL Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 128MX16
Maximum Time At Peak Reflow Temperature (s): 10
Maximum Seated Height: 1.2 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.425 V
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 96
No. of Words: 134217728 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B96
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TFBGA
Width: 9 mm
Moisture Sensitivity Level (MSL): 3
No. of Ports: 1
Memory Density: 2147483648 bit
Self Refresh: YES
Memory IC Type: DDR3 DRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 16
No. of Functions: 1
Length: 13 mm
No. of Words Code: 128M
Nominal Supply Voltage / Vsup (V): 1.5
Additional Features: PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.575 V
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