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| Manufacturer | Integrated Silicon Solution |
|---|---|
| Manufacturer's Part Number | IS66WVH16M8ALL-166B1LI |
| Description | PSEUDO STATIC RAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | IS66WVH16M8ALL-166B1LI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .00002 Amp |
| Organization: | 16MX8 |
| Output Characteristics: | 3-STATE |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 60 mA |
| No. of Terminals: | 24 |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TBGA |
| Width: | 6 mm |
| Input/Output Type: | COMMON |
| Memory Density: | 134217728 bit |
| Memory IC Type: | PSEUDO STATIC RAM |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA24,5X5,40 |
| Length: | 8 mm |
| Maximum Access Time: | 36 ns |
| No. of Words Code: | 16M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.95 V |
| Power Supplies (V): | 1.8 |
