Integrated Silicon Solution - IS66WVH16M8ALL-166B1LI

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IS66WVH16M8ALL-166B1LI by Integrated Silicon Solution

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Manufacturer Integrated Silicon Solution
Manufacturer's Part Number IS66WVH16M8ALL-166B1LI
Description PSEUDO STATIC RAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
Datasheet IS66WVH16M8ALL-166B1LI Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00002 Amp
Organization: 16MX8
Output Characteristics: 3-STATE
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.7 V
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 60 mA
No. of Terminals: 24
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B24
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: TBGA
Width: 6 mm
Input/Output Type: COMMON
Memory Density: 134217728 bit
Memory IC Type: PSEUDO STATIC RAM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA24,5X5,40
Length: 8 mm
Maximum Access Time: 36 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.95 V
Power Supplies (V): 1.8
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