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| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | 10M04DCU324C8G |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | 10M04DCU324C8G Datasheet |
| In Stock | 79 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.15 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 250 CLBS |
| Maximum Seated Height: | 1.55 mm |
| No. of Inputs: | 246 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 246 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 324 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B324 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 85 °C (185 °F) |
| Package Code: | BGA |
| Width: | 15 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Grading Of Temperature: | Other |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | 1.25 V |
| Nominal Supply Voltage (V): | 1.2 |
| No. of Logic Cells: | 4000 |
| No. of CLBs: | 250 |
| Minimum Operating Temperature: | 0 °C (32 °F) |
| Qualification: | No |
| Package Equivalence Code: | BGA324,18X18,32 |
| Length: | 15 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .8 mm |
| Power Supplies (V): | 1.2 V |









