Intel - AF82801IEM/SLB8P

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AF82801IEM/SLB8P by Intel

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Manufacturer Intel
Manufacturer's Part Number AF82801IEM/SLB8P
Description Other uPs/uCs/Peripheral ICs; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
Datasheet AF82801IEM/SLB8P Datasheet
In Stock90
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Maximum Supply Current: 308 mA
No. of Terminals: 676
Qualification: Not Qualified
Package Equivalence Code: BGA676,29X29,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B676
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Terminal Pitch: 1 mm
Power Supplies (V): 1.05,1.5,3.3,5
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