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Manufacturer | Intel |
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Manufacturer's Part Number | AF82801IEM/SLB8P |
Description | Other uPs/uCs/Peripheral ICs; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm; |
Datasheet | AF82801IEM/SLB8P Datasheet |
In Stock | 90 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Sub-Category: | Other Microprocessor ICs |
Surface Mount: | YES |
Maximum Supply Current: | 308 mA |
No. of Terminals: | 676 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA676,29X29,40 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B676 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | BGA |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1.05,1.5,3.3,5 |