Image shown is a representation only.
| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | AU80610004653AA/SLBMG |
| Description | MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 559; Package Code: BGA; Package Shape: SQUARE; Bit Size: 64; |
| Datasheet | AU80610004653AA/SLBMG Datasheet |
| In Stock | 431 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .8 V |
| Package Body Material: | PLASTIC/EPOXY |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 2.35 mm |
| Sub-Category: | Microprocessors |
| Surface Mount: | YES |
| Maximum Supply Current: | 5770 mA |
| No. of Terminals: | 559 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY |
| Address Bus Width: | 15 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B559 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Width: | 22 mm |
| Speed: | 1660 rpm |
| Peripheral IC Type: | MICROPROCESSOR |
| Maximum Supply Voltage: | 1.175 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 64 |
| Bit Size: | 64 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA559(UNSPEC) |
| Length: | 22 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Power Supplies (V): | 0.8/1.175,1.5,1.8 |









