NXP Semiconductors - MCF5251CVM140R2

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MCF5251CVM140R2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCF5251CVM140R2
Description MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCF5251CVM140R2 Datasheet
In Stock4,576
NAME DESCRIPTION
Minimum Supply Voltage: 1.08 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.2 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 225
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Address Bus Width: 24
Technology: CMOS
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 140 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Speed: 140 rpm
Peripheral IC Type: MICROPROCESSOR
Maximum Supply Voltage: 1.32 V
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Length: 13 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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