
Image shown is a representation only.
Manufacturer | NXP Semiconductors |
---|---|
Manufacturer's Part Number | MCIMX6L8DVN10AB |
Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 576; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | MCIMX6L8DVN10AB Datasheet |
In Stock | 1,569 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.375 V |
Package Body Material: | PLASTIC/EPOXY |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.1 mm |
Surface Mount: | YES |
Maximum Supply Current: | 1100 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 576 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
No. of I/O Lines: | 162 |
Address Bus Width: | 16 |
Technology: | CMOS |
RAM Words: | 16384 |
JESD-30 Code: | S-PBGA-B |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 95 Cel |
Package Code: | TFBGA |
Width: | 13 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1000 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.5 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA432,24X24,20 |
Length: | 13 mm |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB |
Terminal Pitch: | .5 mm |
Temperature Grade: | OTHER |