Intel - EP2C35F672C8N

EP2C35F672C8N by Intel

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Manufacturer Intel
Manufacturer's Part Number EP2C35F672C8N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
Datasheet EP2C35F672C8N Datasheet
In Stock254
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: Plastic/Epoxy
Organization: 2076 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.6 mm
No. of Inputs: 475
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 459
Position Of Terminal: Bottom
No. of Terminals: 672
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B672
Maximum Clock Frequency: 402.5 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.25 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 33216
No. of CLBs: 2076
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA672,26X26,40
Finishing Of Terminal Used: Tin/Silver/Copper
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Also requires 3.3 V supply
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,1.5/3.3,3.3 V
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