Intel - FJ8067702739740SR2ZV

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.

MC8640DTVJ1250HE by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max frequency of 166.66 MHz. Ideal for industrial applications, it features a ceramic package body, boundary scan capability, and supports floating-point format computations.

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;

AM3352BZCZT60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for automotive applications requiring low power mode and boundary scan capability. With a temperature range from -40 to 125 °C, it offers high performance in compact square package style.

AM3352BZCED60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 90°C and boundary scan capability.

Motorola MC7455ARX1000LG is a 32-bit microprocessor with integrated cache and 64-bit external data bus. Operating at a max clock frequency of 133 MHz, it features low power mode and boundary scan for efficient performance. Ideal for applications requiring high-speed processing in compact devices due to its small package size and ceramic-metal sealed body material.

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

AM3505AZERAC by Texas Instruments is a 16-bit microprocessor with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various electronic devices. The package style is grid array with 484 terminals, making it ideal for compact designs requiring high processing speeds.

NXP Semiconductors' MPC8313CVRAFFC microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66.67 MHz. Ideal for low power applications, it integrates cache memory and supports boundary scan testing.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

Microprocessors;

The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

The NXP Semiconductors MPC8280CZUUPEA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 100 MHz, suitable for commercial-grade applications requiring high-speed processing. The package style is grid array, low profile, making it ideal for compact electronic devices.

ADSP-21488KSWZ-4B1 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 25 MHz, making it suitable for applications requiring high-speed processing in commercial temperature environments. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;

NXP Semiconductors' MCF5372LCVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85°C. Package style is grid array with 196 terminals in a square shape.