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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MCIMX537CVV8C |
Description | MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | MCIMX537CVV8C Datasheet |
In Stock | 1,469 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .9 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .95 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.85 mm |
Surface Mount: | YES |
Maximum Supply Current: | 1450 mA |
Terminal Finish: | TIN SILVER |
No. of Terminals: | 529 |
No. of Serial I/Os: | 2 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
No. of I/O Lines: | 19 |
Address Bus Width: | 26 |
Technology: | CMOS |
RAM Words: | 73728 |
JESD-30 Code: | S-PBGA-B529 |
Maximum Clock Frequency: | 27 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | FBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 800 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.15 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA529,23X23,32 |
Length: | 19 mm |
Additional Features: | 1.1V NOMIVAL AVAILABLE WITH 800MHZ |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB |
Terminal Pitch: | .8 mm |
Temperature Grade: | AUTOMOTIVE |